Noctua introduces new thermal compounds and cleaning wipes
“First introduced in 2007 and shipped with our premium-quality CPU coolers for more than 10 years, our NT-H1 thermal compound has proven its excellent performance in countless tests and reviews,” says Roland Mossig (Noctua CEO). “It’s chosen again and again by overclockers and hardware enthusiasts around the globe, not only for its efficiency but also for its ease of application and cleaning. Today, we’re proud to present the new, second-generation NT-H2 that provides even better performance!”
Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture of metal oxide microparticles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieve an even better performance in most application scenarios. In Noctua’s standardised internal testing at various platforms and heat loads, up to 2°C lower temperatures were attained.
Just like NT-H1, NT-H2 does not require a break-in period and due to its excellent long-term stability, it can be used on the CPU for up to 5 years. Both pastes are electrically non-conductive and non-corroding, so there is no risk of short circuits and they’re safe to use with all types of heatsink.
NT-H2 will come in standard 3.5g and extra-large 10g packages that include three (3.5g) and ten (10g) NA-CW1 cleaning wipes for easy cleaning. Pre-moistened with a custom detergent mixture, these wipes are ideal for cleaning CPUs, GPUs and the contact surface of heatsinks in a quick and efficient manner. For enthusiast users who take off and install their coolers frequently, the NA-CW1 wipes are also available separately in a set of 20 (NA-SCW1).
In addition to the new NT-H2 and NA-SCW1 cleaning wipes, Noctua also introduced a new 10g package of NT-H1. While, so far, the popular paste has only been available in a 3.5g package, the new 10g version is ideal for power users or for large processors such as AMD’s Threadripper (TR4) or Intel’s LGA3647 that require higher volumes of thermal compound.